Semiconductor fabrication
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithograp...
Semiconductor fabrication - Wikipedia
The Challenge Of Mining Rare-Earth Materials Outside China
Five years ago, the cost of rare-earth materials that are critical for today’s electronics went through the roof. An export quota set by China, which mines most of the world’s rare earths, caused the ...
A New Kind Of Wood Chip: Collaboration Could Lead To Biodegradable Computer Chips
In an effort to alleviate the environmental burden of electronic devices, a team of University of Wisconsin-Madison researchers has collaborated with researchers in the Madison-based U.S. Department o...
3-D Microbattery Suitable For Large-Scale On-Chip Integration
y combining 3-D holographic lithography and 2-D photolithography, researchers from the Univ. of Illinois at Urbana-Champaign have demonstrated a high-performance 3-D microbattery suitable for large-sc...
New Chip Architecture May Provide Foundation For Quantum Computer
Quantum computers are in theory capable of simulating the interactions of molecules at a level of detail far beyond the capabilities of even the largest supercomputers today. Such simulations could re...
The Law That Predicts Computing Power Turns 50
Today represents a historic milestone in technology: it's the 50th anniversary of Moore's Law, the observation that the complexity of computer chips tends to double at a regular rate. On April 19th, 1...
Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small plate ("chip") of semiconductor material, normal...
Integrated circuit - Wikipedia
Wafer (semiconductor)
A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics...
Wafer (semiconductor) - Wikipedia
FEOL
The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) are patterned in the semiconductor. FEOL generally covers ev...
BEOL
The back end of line (BEOL) is the second portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring on the wafer. BEOL generally ...
Wafer testing
Wafer testing is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on...
Wafer testing - Wikipedia
Wafer backgrinding
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow for stacking and high density packaging of integrated circuits (IC).ICs are being produce...
Die preparation
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer moun...
Die preparation - Wikipedia
Integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case th...
The Challenge Of Mining Rare-Earth Materials Outside China
Five years ago, the cost of rare-earth materials that are critical for today’s electronics went through the roof. An export quota set by China, which mines most of the world’s rare earths, caused the ...
List of Intel Core i5 microprocessors
The following is a list of Intel Core i5 brand microprocessors.
Multi-threshold CMOS
Multi-threshold CMOS (MTCMOS) is a variation of CMOS chip technology which has transistors with multiple threshold voltages (Vth) in order to optimize delay or power. The Vth of a MOSFET is the gate v...
Low-profile Quad Flat Package
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not...
Low-profile Quad Flat Package - Wikipedia
Intel MCS-48
The MCS-48 microcontroller (µC) series, Intel's first microcontroller, was originally released in 1976. Its first members were 8048, 8035 and 8748. Initially this family was produced using NMOS-techno...
Intel MCS-48 - Wikipedia
Zilog Z80000
The Z80000 ("zee-eighty-thousand" American, "zed-eighty-thousand" British) is Zilog's 32-bit processor, first released in 1986. It is essentially a 32-bit expansion of its 16-bit predecessor, the Zilo...
List of Intel Pentium 4 microprocessors
The Pentium 4 microprocessor from Intel is a seventh-generation CPU targeted at the consumer market.
List of Intel Pentium 4 microprocessors - Wikipedia
Programmable sound generator
A programmable sound generator, or PSG, is a sound chip that generates sound waves by synthesizing multiple basic waveforms, and often some kind of noise generator, (all controlled by writing data to ...
DirectCompute
Microsoft DirectCompute is an application programming interface (API) that supports general-purpose computing on graphics processing units on Microsoft's Windows Vista, Windows 7, and Windows 8. Direc...
Intel 82497
The Intel 82497 is a Cache Controller for the P5 Pentium processor. It works with multiple 82492 Cache SRAMs.
The 82497 Cache Controller implements the MESI write-back protocol for full multiproce...
Intel 82497 - Wikipedia
Intel 8259
The Intel 8259 is a Programmable Interrupt Controller (PIC) designed for the Intel 8085 and Intel 8086 microprocessors. The initial part was 8259, a later A suffix version was upward compatible and us...
Intel 8259 - Wikipedia
ATmega88
The ATmega88 is an electronic integrated circuit microcontroller produced by the Atmel corporation. It has the basic Atmel AVR instruction set. One of the packaging configurations is the dual in-line ...
POWER6
The POWER6 is a microprocessor developed by IBM that implemented the Power ISA v.2.03. When it became available in systems in 2007, it succeeded the POWER5+ as IBM's flagship Power microprocessor. It ...
Stepping (version numbers)
The term stepping level in the context of CPU architecture or integrated circuit is a version number.Stepping level refers to the introduction or revision of the lithographic photomask or masks within...
WDC 65816/65802
The W65C816S (also 65C816 or 65816) is a 16-bit microprocessor (MPU) developed and sold by the Western Design Center (WDC).  Introduced in 1983, the W65C816S is an enhanced version of the WDC 65C...
WDC 65816/65802 - Wikipedia
Rock (processor)
Rock (or ROCK) was a multithreading, multicore, SPARC microprocessor developed at Sun Microsystems. Now canceled, it was a separate development from the SPARC T-Series (CoolThreads/Niagara) family of ...
Rock (processor) - Wikipedia