List of integrated circuit packaging types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of p...
List of integrated circuit packaging types - Wikipedia
Pin grid array
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the...
Pin grid array - Wikipedia
Quad Flat Package
A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not...
Quad Flat Package - Wikipedia
Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provid...
Ball grid array - Wikipedia
Quad Flat No-leads package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as mic...
Wafer bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensurin...
UICC
The Universal Integrated Circuit Card (UICC) is the smart card used in mobile terminals in GSM and UMTS networks. The UICC ensures the integrity and security of all kinds of personal data, and it typi...
UICC - Wikipedia
Flip chip
Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to e...
Flip chip - Wikipedia
Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connectin...
Dual in-line package - Wikipedia
E-Material
E-Material, also called E Material, is a metal matrix composite consisting of beryllium matrix with beryllium oxide particles. It has high thermal conductivity (210-230 W/m K), and its thermal expansi...
Bond characterization
The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by void for...
Bond characterization - Wikipedia
Embedded Wafer Level Ball Grid Array
Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound...
Embedded Wafer Level Ball Grid Array - Wikipedia
Adhesive bonding
Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with applying an intermediate layer to connect substrates of different materials. These produced conne...
Adhesive bonding - Wikipedia
Semiconductor package
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more semiconductor electronic components. Individual discrete components are typically etched in silicon wafer ...
Semiconductor package - Wikipedia
Direct bonding
Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numero...
Direct bonding - Wikipedia
Through-hole technology
Through-hole technology, also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in...
Through-hole technology - Wikipedia
Glass frit bonding
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for su...
Glass frit bonding - Wikipedia
Low insertion force
Low insertion force (LIF) is a technology used in integrated circuit sockets that are designed so the force required to insert or remove a package is low.Initially, the LIF connectors were designed as...
Low insertion force - Wikipedia
Co-fired ceramic
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the s...
Chip carrier
In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four edges of a square package; Compared to the intern...
Chip carrier - Wikipedia
Eutectic bonding
Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a eutectic system. Those eutectic metals are alloys that...
Eutectic bonding - Wikipedia
Multi-chip module
A multi-chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete components are packaged onto a unifying substrate, facilita...
Multi-chip module - Wikipedia
Anodic bonding
Anodic bonding is a process to seal glass to either silicon or metal; it is commonly used to seal glass to thin pieces of silicon in electronics and microfluidics. In the electronics industry, the ter...
Anodic bonding - Wikipedia
Flatpack (electronics)
Flatpack is a US military standardized Printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads...
Flatpack (electronics) - Wikipedia
Electronic packaging
Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the prod...
Electronic packaging - Wikipedia
Integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case th...
Zig-zag in-line package
The zig-zag in-line package or ZIP was a short-lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in-line packaging (DIL or ...
Zig-zag in-line package - Wikipedia
Cerquad
Cerquad, or Ceramic Quadpack, is a type of surface mount chip package. It uses a ceramic lid that is bonded to the chip with a glass seal. It has pins on all four sides that wrap under like those of a...
Multi-leaded power package
The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-...
Multi-leaded power package - Wikipedia
Package on package
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i...
Package on package - Wikipedia