Integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case th...
Integrated circuit packaging - Wikipedia
Semiconductor package
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more semiconductor electronic components. Individual discrete components are typically etched in silicon wafer ...
Semiconductor package - Wikipedia
Wafer bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensurin...
Anodic bonding
Anodic bonding is a process to seal glass to either silicon or metal; it is commonly used to seal glass to thin pieces of silicon in electronics and microfluidics. In the electronics industry, the ter...
Anodic bonding - Wikipedia
Thermosonic bonding
Thermosonic bonding is the most widely used wire bonding method to electrically connect silicon integrated circuits. It was introduced by Alexander Coucoulas in 1966. Owing to the reliability of a the...
Thermosonic bonding - Wikipedia
TO-92
The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost.
The JEDEC TO-92 desc...
TO-92 - Wikipedia
Eutectic bonding
Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a eutectic system. Those eutectic metals are alloys that...
Eutectic bonding - Wikipedia
Reactive bonding
Reactive bonding describes a wafer bonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates. The multilayer system consists of two ...
Reactive bonding - Wikipedia
Co-fired ceramic
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the s...
System in package
A system in package (SiP) or system-in-a-package, also known as a Chip Stack MCM. An SiP is a number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the ...
Thermocompression bonding
Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold (A...
Thermocompression bonding - Wikipedia
Adhesive bonding
Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with applying an intermediate layer to connect substrates of different materials. These produced conne...
Adhesive bonding - Wikipedia
Three-dimensional integrated circuit
In microelectronics, a “three dimensional integrated circuit” (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-sil...
Three-dimensional integrated circuit - Wikipedia
TO-5
In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a s...
Bond characterization
The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by void for...
Bond characterization - Wikipedia
Package on package
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i...
Package on package - Wikipedia
TO-126
TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting and/or heatsinking.
The ...
TO-126 - Wikipedia
DO-214
DO-214 is a standard that specifies a group of semiconductor packages for surface mounted diodes. The standard includes multiple variants such as DO-214AA(SMB), DO-214AB(SMC), and DO-214AC(SMA).
DO-214 - Wikipedia
Plasma-activated bonding
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are ...
Plasma-activated bonding - Wikipedia
TO-66
TO-66 is a type of semiconductor package for devices with three pins, such as transistors. The shape is similar to the TO-3 package, but the size is smaller.
TO-66 - Wikipedia
Glass frit bonding
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for su...
Glass frit bonding - Wikipedia
Redistribution layer
A Redistribution Layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations.
When an integrated circuit is manufactured, it usually ...
MELF electronic components
MELF is the acronym for metal electrode leadless face - a type of leadless cylindrical electronic surface mount device that is metallized at its ends. MELF devices are usually diodes and resistors.The...
MELF electronic components - Wikipedia
TO-3
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The TO element stands for "transistor outline" and refers to a s...
TO-3 - Wikipedia
TO-18
In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying Transistor O...
Electronic packaging
Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the prod...
Electronic packaging - Wikipedia
TO-220
The TO-220 is a style of electronic component package, commonly used for discrete semiconductors as transistors and silicon-controlled rectifiers, as well as integrated circuits. The "TO" designation...
TO-220 - Wikipedia
Small Outline Diode
Small Outline Diode (SOD) is a designation for a group of semiconductor packages for surface mounted diodes. The standard includes several variants such as SOD-123, SOD-323, SOD-523 and SOD-923.
Small Outline Diode - Wikipedia
Direct bonding
Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numero...
Direct bonding - Wikipedia
Quilt packaging
Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect technology that incorporates conductive “nodules” fabricated on the sides of chips. These nodule structures functi...
Quilt packaging - Wikipedia